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Technology
THICK COPPER MULTILAYER BOARD Date:【2018-01-05】 Read【1300】 【Back

 
1, product features
Inside and outside the copper thickness ≥ 3OZ
Inductor coil design
 
 
2, product advantages
Ultra-thick inner and outer copper thickness greatly reduces the thermal effect of the product during use;
For the high-power power supply module to provide more secure reliability.
 
 
3, the application areas

 

4, the core technology
Thick copper laminated structure, thick copper edge design, thick copper laminating technology, buried blind hole plug hole technology, thick copper welding technology
 
5, process capacity