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Parameter Layers: 2L material: 1oz CU, 1 mil PI and 1 mil ADH Board Thickness: 0.15 mm Stiffener tolerance: 0.15mm Steel sheet Coverlid tolerance: ±0.03mm Line/Space/width: 0.06/0.09 mm Copper Thicknes: 70 um Smallest Hole Diameter: 0.4 mm Impedance control: 50 Ω ±10% Surface treatment: ENIG(1U') Technical Feature: Foldaway space saving and lightweight