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技术与应用
刚挠结合板 Date:【2018-01-05】 Read【1042】 【Back

 

                                                                                    1、基本参数


                                                                                    产品类型:刚挠结合板


                                                                                    应用领域:电脑/通讯/医疗/汽车/航天/军事


                                                                                    层数/板厚:6L/1.2MM


                                                                                    表面处理:沉金


                                                                                    线宽/线距:5.0/5.0MIL


                                                                                    最小孔径:0.2MM


                                                                                    技术特点:刚挠结合、多接枝结构

 

 


                                                                                    2、功能及特色


                                                                                    刚挠结合板,是将薄层状的挠性材料和刚性材料相结合,

                                                                                    有序地层压在一起组成,并以金属化孔形成电气互连的电路板,

                                                                                    具有可弯曲、可折叠的特点。其改变了传统的平面式的设计概念,

                                                                                    扩大到立体的三维空间。


                                                                                    与普通板刚性板或挠性板对比,

                                                                                    刚挠结合板既可以提供刚性板应有的支撑作用,

                                                                                    又有挠性板的弯曲性,能够满足三维组装的要求。

                                                                                    刚挠结合板设计思想是节省空间,提高装配可靠性。

 


                                                                                    3、应用领域


 

 

 

4、产品展示