1, taking into account the difference between the product process and storage conditions, printed circuit board should be promptly used after unpacked (recommended within 24 hours), and the proposed pre-drying, especially in the flexible circuit board PI substrate board , If necessary

Patch welding, it must be pre-drying treatment.

2, for chemical immersion tin or immersion silver products after unpacking recommended within 12 hours of use, or to be re-packaging.

3, if stocked more than the effective shelf life, the boards should be baked first, then test a trial use. some performances should be retested if necessary before using.

4, usually save more than 3 months in the machine before the patch in order to avoid the dangers of moisture, the need for 2 hours 150 degrees baking.

5, storage environment:

  A, good storage conditions: refers to the temperature is less than 25 degrees, relative humidity of not more than 65%, there is temperature control, non-corrosive gas indoor environmental conditions.

  B, the general storage conditions: refers to the temperature is not higher than 35 degrees, relative humidity of not more than 75%, non-corrosive gas indoor environmental conditions.