Product Name: Vehicle intelligent diagnostic equipment

 

Technical difficulties: The main device modules include S5E5420, S2MPS11, etc., the main chip 0.4MM BGA, the customer cost is very high, and electromagnetic compatibility in line with product demand.

 

Solution: Designers communicate with the production process department, under the guidance of the power supply experts, the original plan "any order" changed to HDI-3 process, reducing production costs. At the same time, HDI-3 process, still completed all the signal layer impedance control. 4 weeks to complete a one-stop service, and access to customer recognition.

 

Program design: